| No |
Equipment status |
Quantity |
| 1 |
Cutting M/C |
1 |
| 2 |
Inner Layer CCL Cutting M/C |
1 |
| 3 |
PP Cutting M/C |
1 |
| 4 |
Copper Foil Cutting M/C |
1 |
| 5 |
Inner Layer Pre-treatment M/C
|
2 |
| 6 |
Inner Layer Laminating |
2 |
| 7 |
Inner Layer Manual Exposure M/C |
2 |
| 8 |
Inner Layer Automatic Exposure M/C
|
2 |
| 9 |
Inner Layer DES |
1 |
| 10 |
Inner Layer AOI |
5 |
| 11 |
OXIDE |
1 |
| 12 |
Bonding Machine / High-Frequency Bonding Machine 2 |
2 / 1 |
| 13 |
Laminating M/C |
1 |
| 14 |
Layering Machine PRESS |
8 |
| 15 |
X-REY |
2 |
| 16 |
Inner Layer Router |
2 |
| 17 |
STACKKING M/C |
1 |
| 18 |
DRILL (6-axis) |
15 |
| 19 |
DF Pre-treatment M/C |
2 |
| 20 |
Automatic Laminating |
2 |
| 21 |
Manual Laminating |
1 |
| 22 |
DF Automatic Exposure M/C |
2 |
| 23 |
DF Manual Exposure M/C |
3 |
| 24 |
DF LDI |
1 |
| 25 |
DES Line (Developing, Etching, Stripping) |
1 |
| 26 |
AOI |
3 |
| 27 |
VRS |
1 |
| 28 |
Plate making M/C
|
1 |