제조기술
PCB 생산전문기업공정 CAPA
| ITEM | 1공장 | 2공장 |
|---|---|---|
| Production Capa. | 30K m²/month | 15K m²/month |
| Min. Thickness of CCL | 0.1mm/layer (4 mil) | 0.15mm/layer (6 mil) |
| Thick | 0.2mm to 4.0mm | 0.2mm to 4.0mm |
| Out Size (min/max) | 3/1000(mm) | 3/1000(mm) |
| Inner Layer (line/space) | 50/50㎛ (±10%) | - |
| Outer Layer (line/space) | 50/50㎛ (±10%) | 75 / 75㎛ (±10%) |
| Aspect Ratio | 12 : 1 | 12 : 1.5 |
| Heavy Copper | 3 oz | 3 oz |
| Impedance Management | ±10% | ±10% |
| 원자재 | FR-4•1 / AL / CM3 / 테프론 / LOW D/K | FR-4•1 / AL / CM3 |
| MAKER | 난야, 두산, 킹보드, 파나소닉, 생익, 타코닉, 이졸라, 로저스 | 난야, 두산, 킹보드, 생익, 아주스틸 |
